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MAXIM Product Naming Conventions
source: release time:2016-09-19 clicks: 1184

Product Numbers for Proprietary Parts

Most Maxim parts use our own part numbering system which consists of a root part number followed by three or four suffix letters, plus optional additional designators. Example:


(A) is the Root Part Number

The root part number (also called the base part number) identifies the product type, independent of package, temperature, and other variants. Variants such as accuracy grade are usually denoted in the suffix but sometime a variant will be assigned a new root part number.


(B) is the Three- or Four-Letter Suffix

When a part has a four-letter suffix, the first letter of the suffix denotes product grade (accuracy, voltage spec, speed, etc.) For example, the first "A " in MAX631ACPA indicates 5% output accuracy. The product's full data sheet details the grades that apply to that part.

The next three characters are the three-letter suffix. The three letters denote temperature range, package type, and number of pins. The meanings are defined in the tables below.

Example: MAX696CWE
C = Operating Temperature Range C (0°C to +70°C)
W = Package Type W (SOIC 0.300")
E = Number of Pins category E (16 pins for this package)

Please note that suffix codes are not always consistent for different product types. Always refer to the data sheet for details and specifications.


Temperature Ranges
CommercialC 0°C to +70°C
Automotive AEC-Q100 Grade 2G-40°C to +105°C
Automotive AEC-Q100 Grade 0T-40°C to +150°C
Upper CommercialU 0°C to +85°C
Automotive AEC-Q100 Grade 1A-40°C to +125°C
IndustrialI-20°C to +85°C
ExtendedE-40°C to +85°C
MilitaryM-55°C to +125°C


Package Type
ASSOP (Shrink Small Outline Package) 209 mil (14, 16, 20, 24, 28 leads); 300 mil (36 leads)
BUCSP (Ultra-Small Chip Scale Pkg)
CPLASTIC TO-92; TO-220
CLQFP 1.4mm (7mm x 7mm thru 20mm x 20mm)
CTQFP 1.0mm (7mm x 7mm thru 20mm x 20mm)
DCERAMIC SIDEBRAZE 300 mil (8, 14, 16, 18, 20 leads); 600 mil (24, 28, 40, 48 leads)
EQSOP (Quarter Small Outline Package)
FCERAMIC FLATPACK
GMETAL CAN (Gold)
GQFN (Plastic, Very Thin, Quad Flat No Lead - Punch Version) 0.9mm
HSBGA (Super Ball Grid Arrayθ)
HTQFP 1.0mm 5mm x 5mm (32 leads)
HTSSOP (Thin Shrink Small Outline Package) 4.4mm (8 leads)
JCERDIP (Ceramic Dual-Inline) (N) 300 mil (8, 14, 16, 18, 20 leads); (W) 600 mil (24, 28, 40 leads)
KSOT 1.23mm (8 Leads)
LLCC (Leadless Ceramic Chip Carrier) (18, 20, 28 leads)
LFCLGA (Flip Chip Land Grid Array); THIN LGA (Thin Land Grid Array) 0.8mm
LμDFN (Micro Dual Flat No Lead) (6, 8, 10 leads)
MMQFP (Metric Quad Flat Pack) over 1.4mm; ED-QUAD (28mm x 28mm 160 leads)
NPDIP (Narrow Plastic Dual-Inline) 300 mil (24, 28 leads)
PPDIP (Plastic Dual-Inline) 300 mil (8, 14, 16, 18, 20 leads); 600 mil (24, 28, 40 leads)
QPLCC (Plastic Leaded Chip Carrier)
RCERDIP (Narrow Ceramic Dual-Inline) 300 mil (24, 28 leads)
SSOIC (Narrow Plastic Small Outline) 150 mil
TMETAL CAN (Nickel)
TTDFN (Plastic, Very Very Thin, Dual Flat No Lead - Sawn Version) 0.9mm (6, 8, 10, 14 leads)
TTHIN QFN (Plastic, Very Very Thin, Quad Flat No Lead - Sawn Version) 0.8mm
TQTHIN QFN (Plastic, Very Very Thin, Quad Flat No Lead - Sawn Version) 0.8mm (8 leads)
USOT 1.23mm (3, 4, 5, 6 leads)
UTSSOP (Thin Shrink Small Outline Package) 4.4mm (14, 16, 20, 24, 28, 38, 56 leads); 6.1mm (48 leads)
UμMAX (Thin Shrink Small Outline Package) 3mm x 3mm (8, 10 leads)
VU. TQFN (Ultra Thin QFN -Plastic Ultra Thin Quad Flat No Lead - Sawn version) 0.55mm
WSOIC (Wide Plastic Small Outline) 300 mil
WWLP (Wafer Level Pkg)
XCSBGA 1.4mm
XCVBGA 1.0mm
XSC70
YSIDEBRAZE (Narrow) 300 mil (24, 28 leads), ULTRA THIN LGA 0.5mm
ZTHIN SOT 1mm (5, 6, 8 leads)


Number of Pins
A8, 25, 46, 182
B10, 64
C12, 192
D14, 128
E16, 144
F22, 256
G24, 81
H44, 126
I28, 57
J32, 49
K5, 68, 265
L9, 40
M7, 48, 267
N18, 56
O42, 73
P20, 96
Q2, 100
R3, 84
S4, 80
T6, 160
U38, 60
V8 (0.200" pin circle, isolated case), 30, 196
W10 (0.230" pin circle, isolated case), 169
X36, 45
Y8 (0.200" pin circle, case tied to pin 4), 52
Z10 (0.230" pin circle, case tied to pin 5), 26, 72


(C) Additional Suffix Characters

The following characters may appear after the three- or four-letter suffix. They can appear alone or in combination.


Additional Suffix Characters
/883BFully compliant MIL-STD-883 Military product. Parts have their own datasheets, see Standard Microcircuit Drawings.
/HRSimilar to /883B. Offered for devices that have not been certified to MIL-SPEC-883.
/PRRugged Plastic. These are commercial parts which have a higher level of screening to appeal to customers who want something between Commercial-Off-The-Shelf (COTS) and full Military. See Reliability Document PR-1. (PDF, 29kB)
/VAutomotive Qualified. Automotive Qualified parts follow a strict manufacturing and QA process to comply with quality levels accepted by Automotive Industry Worldwide. See Automotive /V Products.
T or T&RPart number is furnished on tape-and-reel
+Indicates a lead-free (RoHS) qualified version. See our lead-free information page.
-Indicates the part is not qualified as lead-free (RoHS). (A lead-free version may also be available. See our lead-free information page.)
#Indicates an RoHS-compliant part which has an exemption for lead. See our lead-free information page.
-D or -TDIndicates that the device has a Moisture Sensitivity Level (MSL) of > 1 and will therefore be drypacked before shipment.
-W"Waivered" device that does not meet data sheet specifications.
+C, -G, or -TGCustom device. Often these relate to special labeling requirements. Request a quote to learn details.
-U/+UFor parts with DS prefix, signifies cut tape.